Fehleranalyse

Decapsulation

Frame based modules

• Package + Si-gel removal
• Polyimid removal

EMC-packages

• Epoxy removal via laser and plasma

Laser

• Coherent Easy Mark 5
• LED-laser

Plasma

• Pink V6-G
• O2 and CF4 plasma etching
• 300W microwave

Methodik

Optical analysis

• Flir A655sc thermal camera
• Keyence VHX-1000 digital microscope