Facilities

Cleanrooms

IMSAS uses a variety of facilities for research, development and production of state-of-the-art microsystems. Two large class ISO 6 cleanrooms with an overall area of 900 m? for front-end and back-end processing of 100 mm and 150 mm wafers are available, offering the complete range of standard MEMS processes: 

Photolithography

• Contact-Lithography
• Laser-Lithography
• 3D-Lithography

Thermal Processing

• Oxidation 
• Diffusion 
• Annealing
• Parylene Coating

 Deposition

• Low Pressure Chemical Vapour Deposition
• Low pressure chemical vapor deposition  (LPCVD) 
• Plasma Enhanced Chemical Vapor Deposition (PECVD) 
• Sputtering
• Evaporation

 Etching

• Wet Etching
• Reactive Ion Etching (RIE)
• Deep Reactive Ion Etching (DRIE) / Advanced Silicon Etching (ASE) 
• Ion Milling Etching
• Plasma etching (PE)

Electro Plating

Waferbonding

• Silicon Fusion Bonding (SFB) 
• Anodic Bonding 
• Eutectic Bonding 
• Solder Bonding 
• Glass-Frit Bonding

Chemisch-Mechanisches Polieren (CMP)

Assembly and Packaging Technology

IMSAS has a great variety of specialised equipment  to enable assembly and packaging technology at the ende of the MEMS production:

• Waferdicing
• Chipbonding
• Wirebonding
• (PCB) Processing

Test and Characterizing

For fabrication as well as for testing and characterization of MEMS (Micorelectromechanical Systems) devices IMSAS has a multitude of measuring instruments and stations:

• Film-Thickness Measurement Tools
• Step Height Prober
• Surface Profiler
• 3D Measurement System
• Gauge for film stress
• 4-Point Resistivity Prober
• Scanning Electron Microscope (SEM)
• X-Ray Fluorescence Spectrometer
• Pressure Measuring Station
• Flow Measuring Station
• Gas Measuring Station
• Climatic Exposure Test Cabinet
• Impedance spectroskopy

Design und Simulation

Numerous design and simulation tools enable IMSAS to create and optimize MEMS designs in-house:

• CoventorWare?
• LabVIEW?
• MATLAB?
• COMSOL Multiphysics?

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